Director, IC Packaging Engineering – Mechanical Simulation
Core
Lead a team of engineers delivering FEA-based mechanical simulation solutions for Qualcomm's current and next-generation chipsets and advanced packaging technologies.
Role type
Senior leadership IC mechanical simulation director
Builds
Mechanical simulation support for High Volume Manufacturing (HVM) and advanced packaging programs
Domain
Semiconductor packaging and mechanical engineering
Deliverable
production ML models
Required skills
FEA modeling and analysis, ANSYS APDL, IC electronic packaging structures, assembly processes, reliability testing and analysis, Chip-Package-Board interaction, thermo-mechanical behavior, simulation automation frameworks, material testing for strength and fracture
Preferred skills
PhD in Mechanical Engineering/Materials Science, 12+ years in FEA for IC packaging, 5+ years managing managers, building high-performing simulation teams, DOE, external customer program leadership
Technologies
ANSYS APDL, OptiSLang
Responsibilities
Drive strategic alignment across IC package design, NPI, assembly, and CPI teams; oversee development and validation of mechanical FEA models; establish BKM methodology for test correlation and material characterization; champion innovation in simulation workflows and automation; present technical roadmaps to executive and customer audiences
Seniority
Director, hands-on IC leadership
