ENGR STAFF, PACKAGE DEV : PKG & ASSY
Core
Lead new package development from conceptualization to functional prototypes, conducting POC builds, benchmarking technologies, and managing technical risks for semiconductor packaging solutions.
Role type
Staff Engineer, Package Development (New Package/Product Development)
Builds
Fully functional packaging prototypes and POC demonstrations
Domain
Semiconductor manufacturing and packaging technology
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Hands-on assembly development, manufacturing experience, process and materials analysis, program management, risk assessment, technical design recommendations, project timing estimation, stakeholder reporting, intellectual property management, cross-functional collaboration with manufacturing and reliability teams
Preferred skills
Experience with equipment and material providers, technology transfer to development sites, market intelligence gathering
Technologies
Semiconductor packaging equipment, assembly tools, materials testing equipment
Responsibilities
Find and create linkages with POC labs and providers; conduct physical POC builds and technology demonstrations; provide POC development costing and project timing; ensure intellectual property coverage; generate and present POC/technology demonstration reports; manage technical risks and mitigation actions; conduct design reviews and risk assessments; transfer technology to development sites; provide recommendations on technical approach and resource allocation; conduct tests and research on basic materials and properties.
Seniority
Staff, hands-on IC with program management responsibilities
