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Hardware & Physical Engineering
› Semiconductor Process Engineering
Semiconductor Process Engineering
3,355 open positions
Failure Analysis Engineer Junior
ON Semiconductor
Roznov pod Radhostem, Vsetin, Czech Republic
4mo
Perform electrical analyses to support external customers, qualify new products, and resolve customer complaints in the automotive sector.
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Films Process Development Engineer
Micron
New York - Remote (B)
$107k–$107k
4mo
Develop and integrate thin film deposition processes for next-generation EUV-enabled DRAM technology, owning concepts from early development through high-volume manufacturing.
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Back Grind/Back Metal Post Fab Engineer
ON Semiconductor
Hopewell Junction, NY, United States
$114k–$114k
4mo
Process Integrator driving continuous improvement, yield enhancement, and new product introduction for wafer thinning and backmetal development in CMOS, BCD, and Image Sensor technologies.
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Technology Development Manager / Senior Manager
ON Semiconductor
Hopewell Junction, NY, United States
$147k–$147k
4mo
Lead the development, qualification, and high-volume manufacturing ramp of Embedded Power Module technologies at a 300mm wafer fab.
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Senior New Product Development Engineer for SiC JFET
ON Semiconductor
Bucheon-si, Gyeonggi-do, Korea, Republic of
4mo
Deliver new SiC JFET power devices to market, ensuring product and process robustness, design for manufacturability, and cost efficiency.
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Mask Technology Scribe Engineer
Texas Instruments
Bengaluru, Karnataka, India
4mo
Develop and maintain tech/fab-specific scribe recipes and reticle floorplan databases to support mask building and reticle generation.
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Wet Process Shift Engineer
Micron
Taoyuan - Fab 11, Taiwan
4mo
Establishing and improving semiconductor manufacturing process conditions and technology to reduce production costs and drive efficiency.
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Principal Engineer – Process Development, Dry Etch, NAND
Micron
Singapore, Singapore
4mo
Provide technical leadership for dry etch process development across critical NAND modules, shaping process roadmaps and solving high-impact structural and device challenges.
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Member of Technical Staff (MTS) – Process Development, Cell Film, NAND
Micron
Singapore, Singapore
4mo
Lead project-level initiatives for NAND cell film process development, executing complex experiments, material characterization, and process integration/fixing to advance thin film manufacturing.
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Principal Engineer – Process Development, Cell Film, NAND
Micron
Singapore, Singapore
4mo
Provide technical leadership for Cell Film process development, defining strategy, and ensuring successful integration of new processes into manufacturing for next-generation NAND device scaling.
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Principal Engineer – Process Development, Wet, NAND
Micron
Singapore, Singapore
4mo
Lead project-level initiatives in wet process development for NAND memory technology, driving integration, transfer readiness, and roadmap alignment for future scaling.
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Staff Engineer – Process Development, Dry Etch, NAND
Micron
Singapore, Singapore
4mo
Drive unit process development and module execution for advanced NAND dry etch, delivering robust process solutions that meet program, yield, and manufacturability targets.
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Staff Engineer – Process Development, Thin Flim (CVD/Diffusion), NAND
Micron
Singapore, Singapore
4mo
Owns defined portions of NAND Advanced Thin Films process space (dielectric/carbon film processes via CVD/Diffusion), driving robustness, capability, and integration readiness.
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Staff Engineer – Process Development, Photolithography, NAND
Micron
Singapore, Singapore
4mo
Leads module-level photolithography process development for advanced NAND technology nodes, owning process robustness, manufacturability, and readiness for technology transfer.
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Distinguished Member of Technical Staff (DMTS) – Process Development, Photolithography, NAND
Micron
Singapore, Singapore
4mo
Enterprise-level technical leadership defining photolithography strategy and shaping industry-relevant technology directions for semiconductor process development.
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Distinguished Member of Technical Staff (DMTS) – Process Development, Cell Film, NAND
Micron
Singapore, Singapore
4mo
Shape technical vision for cell film processes, lead enterprise-wide programs for 3D NAND scaling, and mentor senior technical leaders.
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STPG NAND Product Development Senior/ Engineer
Micron
MSB, Singapore
4mo
Developing high-quality, cost-effective NAND memory products from early development through high-volume manufacturing, focusing on backend test strategies, yield improvement, and electrical failure analysis.
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Senior Member of Technical Staff (SMTS) – Process Development, Wet, NAND
Micron
Fab 10N/X, Singapore
4mo
Leading technical projects and driving innovation in wet process technology roadmaps for NAND memory manufacturing, focusing on new node yield and device roadmap improvements.
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Member of Technical Staff (MTS) – Process Development, Cell Film, NAND
Micron
Fab 10N/X, Singapore
4mo
Lead project-level initiatives for NAND cell film process development, executing complex experiments and supporting process integration to advance thin film manufacturing.
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Senior Member of Technical Staff (SMTS) – Process Development, Dry Etch, NAND
Micron
Fab 10N/X, Singapore
4mo
Senior technical leader defining, developing, and transferring advanced dry etch processes for NAND technologies, owning key process levels/modules and translating scaling challenges into executable roadmaps.
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Senior Engineer – Process Development, Photolithography, NAND
Micron
Fab 10N/X, Singapore
4mo
Senior Engineer supporting photolithography process development for advanced memory technologies through hands-on experimentation, data analysis, and yield improvement.
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Distinguished Member of Technical Staff (DMTS) – Process Development, Wet, NAND
Micron
Fab 10N/X, Singapore
4mo
Top technical authority shaping long-term wet process and chemistry strategy for NAND memory manufacturing, driving external technical insight and supplier exclusivity.
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Principal Process Engineer, Die Bonding
Micron
Boise, Idaho, United States of America
4mo
Develop, optimize, and validate die bonding processes to improve product quality, reliability, yield, and cost in semiconductor advanced packaging.
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Senior Member of Technical Staff (SMTS) – Process Development, Photolithography, NAND
Micron
Fab 10N/X, Singapore
4mo
Define and lead pathfinding photolithography technologies beyond current roadmaps to shape future technical capability for semiconductor manufacturing.
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Member of Technical Staff (MTS) – Process Development, Dry Etch, NAND
Micron
Fab 10N/X, Singapore
4mo
Lead development of dry etch technology and essential modules to advance next-generation NAND scaling, serving as a dry etch area expert.
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Staff Engineer – Process Development, Wet, NAND
Micron
Singapore, Singapore
4mo
Owns and delivers wet process module execution for advanced NAND, translating device requirements into robust process windows and control strategies to close yield, reliability, and cost gaps.
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ENGR II, MANUFACTURING; MFG
ON Semiconductor
Aizuwakamatsu-Shi, Fukushima, Japan
4mo
CVD process and equipment engineering focused on yield improvement, quality, cost/cycle time reduction, and process robustness for stable production.
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Distinguished Member of Technical Staff (DMTS) – Process Development, Thin Films (CVD/Diffusion), NAND
Micron
Singapore, Singapore
4mo
Shape the technical vision for NAND structural and electrical film processes, leading breakthrough programs and guiding roadmap decisions for enterprise-level impact.
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Principal Process Engineer, Die Bonding
Micron
Boise, ID - Main Site
4mo
Developing, optimizing, and validating die bonding processes to improve product quality, yield, and reliability for next-generation semiconductor memory and storage solutions.
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Member of Technical Staff (MTS) – Process Development, Photolithography, NAND
Micron
Fab 10N/X, Singapore
4mo
Senior technical leader shaping photolithography direction across multiple nodes, influencing integration strategy, and driving innovation in semiconductor process development.
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Distinguished Member of Technical Staff (DMTS) – Process Development, Thin Films (CVD/Diffusion), NAND
Micron
Fab 10N/X, Singapore
4mo
Shaping the technical vision for NAND structural and electrical film processes, leading breakthrough programs, and guiding roadmap decisions for enterprise-level impact.
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Distinguished Member of Technical Staff (DMTS) – Process Development, Cell Film, NAND
Micron
Fab 10N/X, Singapore
4mo
Shaping the technical vision for cell film processes in 3D NAND manufacturing, driving enterprise-wide R&D programs, and mentoring senior technical leaders to guide critical roadmap decisions.
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MTB ASSEMBLY PROCESS ENGINEER
Micron
Taichung City, Taichung City, Taiwan
4mo
Identify, diagnose, and resolve assembly process problems while optimizing equipment and materials for new product introductions.
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Distinguished Member of Technical Staff (DMTS) – Process Development, Photolithography, NAND
Micron
Fab 10N/X, Singapore
4mo
Enterprise-level technical leadership defining photolithography strategy and shaping industry-relevant technology directions for semiconductor process development.
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Member of Technical Staff (MTS) – Process Development, WET, NAND
Micron
Singapore, Singapore
4mo
Senior technical contributor driving wet process development through complex experimentation, material/chemical characterization, and integration fixing for future memory needs.
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Member of Technical Staff (MTS) – Process Development, Photolithography, NAND
Micron
Singapore, Singapore
4mo
Senior technical leader shaping photolithography direction across multiple nodes, defining roadmaps, and driving innovation in semiconductor process development.
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Sr Process Integration Engineer, DRAM
Micron
Boise, Idaho, United States of America
4mo
Develop innovative solutions and integrate brand-new device architectures to produce advanced DRAM memory products.
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Senior Member of Technical Staff (SMTS) – Process Development, Photolithography, NAND
Micron
Singapore, Singapore
4mo
Define and lead pathfinding photolithography technologies beyond current roadmaps to shape future technical capability for NAND memory and storage products.
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JR100843 Staff Engineer – Process Development, Wet, NAND
Micron
Fab 10N/X, Singapore
4mo
Develop and optimize wet processes for advanced NAND technology nodes to improve yield, quality, and process margins.
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Principal Engineer – Process Development, Cell Film, NAND
Micron
Fab 10N/X, Singapore
4mo
Leading technical strategy and end-to-end development of thin film processes for advanced 3D NAND devices to enable scaling and high-volume manufacturing.
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Member of Technical Staff (MTS) – Process Development, WET, NAND
Micron
Fab 10N/X, Singapore
4mo
Senior technical contributor driving wet process development, complex experimentation, and material/chemical characterization for silicon-based memory solutions.
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CIFRE - La découpe laser : un process clé pour la singulation des puces en SiC (F/H)
Stmicroelectronics
Tours, France
4mo
PhD research on laser dicing processes to improve singulation quality and reduce defects in Silicon Carbide (SiC) chips.
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Principal Engineer – Process Development, Wet, NAND
Micron
Fab 10N/X, Singapore
4mo
Leading wet process development and integration for NAND memory technology scaling, driving yield improvement and technology transfer from R&D to manufacturing.
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Distinguished Member of Technical Staff (DMTS) – Process Development, Wet, NAND
Micron
Singapore, Singapore
4mo
Top technical authority shaping long-term wet process and chemistry strategy for NAND memory technologies, driving external technical insights and supplier exclusivity.
♥
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Principal Engineer – Process Development, Thin Film (CVD/Diffusion), NAND
Micron
Singapore, Singapore
4mo
Provide technical leadership for NAND Advanced Thin Films, defining strategy and driving the integration of structural and electrical film processes into manufacturing.
♥
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Member of Technical Staff (MTS) – Process Development, Thin Films (CVD/Diffusion), NAND
Micron
Singapore, Singapore
4mo
Senior technical contributor advancing NAND Advanced Thin Films by leading project-level initiatives, executing complex experiments, and performing material characterization.
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Senior Engineer – Process Development, Dry Etch NAND
Micron
Singapore, Singapore
4mo
Senior Engineer supporting advanced NAND dry etch process development by improving process windows, optimizing recipes, and troubleshooting yield/quality issues.
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JR100843 Staff Engineer – Process Development, Wet, NAND
Micron
Singapore, Singapore
4mo
Develop and optimize wet processes for advanced NAND technology nodes to improve yield, quality, and process margins.
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Senior Member of Technical Staff (SMTS) – Process Development, Thin Films (CVD/Diffusion), NAND
Micron
Singapore, Singapore
4mo
Technical authority in NAND Advanced Thin Films driving innovation, strategy, and multi-functional process development for memory and storage solutions.
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Staff Engineer – Process Development, Thin Flim (CVD/Diffusion), NAND
Micron
Fab 10N/X, Singapore
4mo
Own defined portions of NAND Advanced Thin Films process space (dielectric/carbon film processes via CVD/Diffusion), driving robustness, capability, and integration readiness.
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