Principal Process Engineer, Die Bonding
Core
Developing, optimizing, and validating die bonding processes to improve product quality, yield, and reliability for next-generation semiconductor memory and storage solutions.
Role type
Principal Process Engineer (Die Bonding)
Builds
Advanced packaging interconnects and packaging solutions for memory and storage chips
Domain
Semiconductor manufacturing / Advanced Packaging
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Semiconductor process engineering, Die stacking processes, Design of Experiments (DOE), Failure analysis, FMEA, 8D methodology, SPC/FDC, Data analysis, Project management
Preferred skills
Fusion Bonding, Hybrid Bonding, Direct Bonding, MEMS, Imager, Memory, Heterogeneous Integration, Vendor/Supplier experience
Technologies
SPC, FDC, RMS, APC
Responsibilities
Develop and optimize die bonding process technologies; Execute process, equipment, and material evaluation; Lead continuous yield improvement and cost reduction activities; Validate new process baselines for product introduction; Manage material supplier relationships; Support SPC/FDC/RMS/APC and site-to-site portability; Support internal and external audits
Seniority
Principal, hands-on IC with strategic oversight
