Back Grind/Back Metal Post Fab Engineer
Core
Process Integrator driving continuous improvement, yield enhancement, and new product introduction for wafer thinning and backmetal development in CMOS, BCD, and Image Sensor technologies.
Role type
Process Integrator (Semiconductor Technology Development)
Builds
New semiconductor products (CMOS, BCD, Image Sensors) and novel technologies
Domain
Semiconductor manufacturing and technology development
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
wafer thinning processes, backmetal processes (bond/debond, grind, silicon wet etch, PVD, plating, TSV, RDL), semiconductor manufacturing integration, yield improvement, DOE, 6-sigma, Lean, models-based problem solving, SPC, FMEA, capital equipment evaluation, thermo-mechanical simulations
Preferred skills
power semiconductors integration, BCD integration, assembly processing, advanced module construction, package interconnect processes
Technologies
Excensio, Spotfire, JMP, Minitab, MS Excel, MS Project
Responsibilities
Support new semiconductor technology from early development through volume manufacturing, drive cost reduction through yield enhancement and process simplification, use probe/in-line test/failure analysis data to develop process improvements, influence decisions on capital equipment to enhance technology capabilities
Seniority
Senior, hands-on IC