Principal Engineer – Process Development, Thin Film (CVD/Diffusion), NAND
Core
Provide technical leadership for NAND Advanced Thin Films, defining strategy and driving the integration of structural and electrical film processes into manufacturing.
Role type
Principal Engineer (Process Development, Thin Film)
Builds
Advanced NAND structures and devices
Domain
Semiconductor manufacturing, NAND flash memory
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Thin film deposition (ALD/CVD), process design and optimization, advanced characterization (XRR, ellipsometry, SEM, TEM, SIMS, XPS), electrical evaluation (leakage, impedance, capacitance, breakdown), SPC/DOE/data analytics, novel chemistry/materials/hardware solutions, root cause analysis, technology transfer, cost reduction, yield improvement
Preferred skills
Competitive benchmarking, industry trend assessment, AI tool integration
Technologies
ALD, CVD, XRR, ellipsometry, SEM, TEM, SIMS, XPS
Responsibilities
Define and implement technical strategy for film process development; Lead multi-functional teams to develop, integrate, and scale thin film processes; Oversee end-to-end development of process modules focusing on manufacturability and scalability; Resolve complex technical challenges with business implications; Drive technology transfer from R&D to high-volume manufacturing; Mentor senior engineers and influence technical direction across the organization
Seniority
Principal, strategy & mentorship