Senior Member of Technical Staff (SMTS) – Process Development, Dry Etch, NAND
Core
Senior technical leader defining, developing, and transferring advanced dry etch processes for NAND technologies, owning key process levels/modules and translating scaling challenges into executable roadmaps.
Role type
Senior IC process development engineer (dry etch, NAND)
Builds
Advanced dry etch processes for NAND memory nodes
Domain
Semiconductor manufacturing, NAND flash memory, plasma physics
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Advanced dry etch process development, FOAK execution, plasma etch physics/chemistry understanding, DOE/SPC/control strategy, tool robustness mechanisms, multi-functional execution, technical mentorship, data/model-based yield/defectivity analysis
Preferred skills
AI-enabled analysis/automation for process robustness, patent/publication history, leadership in technical committees
Technologies
Dry etch tools, plasma etch systems, SPC tools, DOE frameworks
Responsibilities
Own key dry etch process levels/modules and translate technology challenges into executable roadmaps; Lead FOAK dry etch development including recipe architecture and control plans; Establish tool robustness mechanisms to improve manufactability; Drive multi-functional execution across Technology Development, Process Integration, and Manufacturing; Act as recognized technical expert and mentor engineers on plasma etch fundamentals
Seniority
Senior, hands-on IC with technical leadership