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Member of Technical Staff (MTS) – Process Development, Dry Etch, NAND

Fab 10N/X, Singapore💼 Full-time🗓 2026-05-06 → 2026-07-31

Core

Lead development of dry etch technology and essential modules to advance next-generation NAND scaling, serving as a dry etch area expert.

Role type

Senior IC process development engineer (dry etch)

Builds

Next-generation NAND memory products

Domain

Semiconductor manufacturing / Memory storage

Deliverable

production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work

Required skills

Deep plasma etch fundamentals, reactor knowledge, high aspect ratio etch scalability, DOE/SPC/statistics, model-based problem solving

Preferred skills

Data science basics, Python coding, AI-assisted analysis

Technologies

Dry etch reactors, AI-assisted tools

Responsibilities

Lead development of dry etch technology and essential modules; develop/innovate dry etch processes to meet structural and electrical specifications; work closely with hardware teams to develop the equipment roadmap; lead multi-functional teams to solve complex structural problems; mentor less-experienced engineers

Seniority

Senior, hands-on IC with mentorship

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