Staff Engineer – Process Development, Thin Flim (CVD/Diffusion), NAND
Core
Staff Engineer owns defined portions of NAND Advanced Thin Films process space (dielectric/carbon film via CVD/Diffusion), driving robustness, capability, and integration readiness.
Role type
Staff Engineer, hands-on IC process development
Builds
Scalable NAND memory processes and modules
Domain
Semiconductor manufacturing / NAND flash memory
Required skills
Thin film deposition (CVD/Diffusion), materials/chemistry/process physics, fab metrology, plasma processes, vacuum systems, chemical reactions, experimental design, data analysis, root-cause investigation, tool qualification, cross-functional collaboration
Preferred skills
NAND thin film structure knowledge, AI-assisted tool integration
Technologies
CVD, Diffusion, Plasma systems, Vacuum systems, Fab metrology tools
Responsibilities
Develop and optimize thin film processes to meet performance and reliability targets; execute experiments and translate results into process improvements; own process module/sub-module scope and track margins/sensitivities; correlate material/structural/electrical data for integration; support tool qualifications and upgrades; mentor junior engineers
Seniority
Staff, hands-on IC with module ownership