Staff Engineer – Process Development, Thin Flim (CVD/Diffusion), NAND
Core
Own defined portions of NAND Advanced Thin Films process space (dielectric/carbon film processes via CVD/Diffusion), driving robustness, capability, and integration readiness.
Role type
Staff Engineer, Process Development (Thin Films)
Builds
Scalable NAND memory modules and sub-modules
Domain
Semiconductor manufacturing, NAND flash memory, Thin film deposition
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Thin film deposition fundamentals (CVD/Diffusion), Materials science and process physics, Fab metrology and film characterization, Plasma processes and vacuum systems, Experimental design and data analysis, Cross-functional collaboration, Technical troubleshooting
Preferred skills
NAND thin film structure knowledge, AI-assisted tool integration
Technologies
CVD, Diffusion, Plasma etch, Vacuum systems, Metrology tools
Responsibilities
Develop and optimize thin film processes to meet performance and reliability targets, Execute experiments and translate results into process improvements, Own process module scope and track integration risks, Correlate material and electrical data to guide optimization, Support tool qualifications and upgrades, Mentor junior engineers
Seniority
Staff, hands-on IC with module ownership
