CIFRE - La découpe laser : un process clé pour la singulation des puces en SiC (F/H)
Core
PhD research on laser dicing processes to improve singulation quality and reduce defects in Silicon Carbide (SiC) chips.
Role type
PhD Researcher (Industrial Doctorate)
Builds
Advanced laser dicing methods for semiconductor manufacturing
Domain
Semiconductor manufacturing / Laser physics / Materials science
Deliverable
research
Required skills
Laser characterization, Microstructure analysis, Microelectronics process knowledge, Material characterization techniques (SEM, FTIR, EDX)
Preferred skills
Knowledge of SiC substrates, Process optimization
Technologies
Laser systems, SEM, FTIR, EDX
Responsibilities
Characterize laser beams and configurations, Analyze laser impact on substrate microstructure and metallization, Optimize laser dicing process parameters, Study potential new defects
Seniority
PhD Candidate
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