Principal Engineer – Process Development, Dry Etch, NAND
Core
Provide technical leadership for dry etch process development across critical NAND modules, shaping process roadmaps and solving high-impact structural and device challenges.
Role type
Principal Engineer, Process Development (Dry Etch)
Builds
Advanced NAND memory structures and devices
Domain
Semiconductor manufacturing, NAND flash memory
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
dry etch technology fundamentals, plasma physics/chemistry, reactor types/chemistries, SPC/DOE/statistical analysis, structured root cause analysis, technical leadership through influence, cross-functional alignment
Preferred skills
data science basics, Python, AI-enabled analysis
Technologies
plasma etch reactors, AI-assisted tools
Responsibilities
Lead dry etch unit process and critical module development; Lead cross-functional teams to solve complex structural problems; Present and drive dry etch process and technology roadmaps; Drive advanced scalability solutions for high aspect ratio etches; Lead supplier head-to-heads and vendor engagements; Provide technical mentorship and act as a resource for peers
Seniority
Principal, hands-on IC with strategic roadmap ownership