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Software Engineering
› Hardware Verification
Hardware Verification
796 open positions
CAD Support - Student
Altera
TLV, IL
6mo
Supporting and stabilizing EDA tools and version management systems for global teams developing high-speed communication devices.
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Senior Manager - HIG-HBM Product Engineering (Media Health Reliability)
Micron
Fab 10A, Singapore
6mo
Spearhead and develop a high-performing team driving intrinsic and extrinsic reliability test development and execution for Micron's latest HBM products (DRAM, Interface die, and stacked products) to ensure quality, cost, and cycle time KPIs.
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Senior Engineer - PEE
Micron
Fab 10N/X, Singapore
6mo
Upgrading process capabilities and implementing strategies to reduce production costs in semiconductor frontend fabrication.
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Staff/Senior Engineer -Package Health System and Analytics
Micron
Fab 10A, Singapore
6mo
Develop and execute package health monitoring, simulation, and characterization activities to ensure robust semiconductor packaging solutions.
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Senior C++ Software Engineer (Leading-Edge, High-Performance R&D solutions) - Hybrid model, Shannon.
Siemens-Eda
Shannon, IRL, Ireland
$68k–$68k
6mo
Design, develop, and optimize high-performance, production-ready components for next-generation Electronic Design Automation (EDA) applications, focusing on distributed systems and low-latency operations.
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CAD Engineer
NVIDIA
India, Bengaluru
6mo
Architecting and developing end-to-end EDA tool flows to auto-generate system fabrics, sub-systems, and SOC hierarchies for chip designers.
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Senior/Staff/Principal - Adv Pkg TD Integrator
Micron
Fab 10A, Singapore
6mo
Developing advanced packaging process solutions to ensure success for new processes, equipment, materials, and pathfinding activities for all advanced packaging products.
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Mixed-Signal Digital IC Design Engineer(Serdes, High Speed Interface)
MediaTek
HsinChu
6mo
Architecting, coding, and integrating Serdes/High Speed Interface PHYD IP for digital logic and analog co-simulation.
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High-speed transmission interface IP development software/firmware engineer
MediaTek
ChuPei
6mo
Design and develop IP drivers, software system architectures, and AI-assisted design flows for high-speed SerDes communication interfaces.
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Manufacturing Equipment Technician - Backend
ON Semiconductor
Mountain Top, PA, United States
$5k–$5k
6mo
Maintain and troubleshoot semiconductor manufacturing equipment including ion implant, metals sputter deposition, wafer thinning, and probe test systems.
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DRAM Firmware Engineer
MediaTek
HsinChu
6mo
Develop ASIC Memory IP driver software and IC verification environments, performing bring-up and system integration.
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Hardware Tools Engineer
OpenAI
San Francisco
6mo
Develop and evolve the tooling ecosystem for hardware engineers, including compilers, IR transformations, simulation, debugging, and automation infrastructure to accelerate AI system design.
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Field Application Engineer_Catapult
Siemens-Eda
Tokyo, JPN, Japan
$0k–$0k
7mo
Provide technical support and solution proposals for Siemens EDA's Catapult High-Level Synthesis & Verification software to chip and system design customers.
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Senior Formal Verification Engineer – AI SoC Development
Intel
US, California, Folsom
$221k–$312k
7mo
Ensuring functional correctness of complex digital designs for AI SoCs using advanced formal methods.
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ENGINEER, F10 SPM PMO
Micron
Fab 10N/X, Singapore
7mo
Manage programs and projects for site strategic objectives in infrastructure, people, technology, cost, and manufacturing efficiency to achieve Best-In-Class performance.
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Senior Build and Release Methodology Engineer
NVIDIA
India, Bengaluru
7mo
Architecting and developing scalable SOC build and IP release infrastructure to handle increasing complexity in System-on-Chip development.
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Senior / Staff Engineer, Front End Central Operations Strategy, Yield Enhancement
Micron
Hiroshima - Fab 15, Japan
7mo
Lead strategic initiatives and yield modeling to drive yield improvement across DRAM/NAND/HBM technologies and transform YMS systems.
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Materials Planning Engineer - Front End US Expansion
Micron
Boise, ID - Main Site
7mo
Manage spares and materials forecasts for Fab tools to ensure flawless forecasting and prevent inventory shortages or material expiry issues that could halt production.
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Global Software Support Engineer
Amat
Bangalore,IND
7mo
Resolve software issues for the semiconductor manufacturing equipment install base, validate functionality, and act as the interface between customers and the software development team.
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NAND BM IP DV Engineer
Samsung Electronics
7mo
Developing test environments, test benches, bus protocol checking, transaction level checking, and constraint random verification for Samsung memory products.
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Digital Engineer Intern
Renesas-Electronics
Lviv, ua
7mo
Design, simulation, verification, and lab evaluation of basic digital circuits.
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Intern of the Device Modeling
Cadence
BEIJING 04
7mo
Assist with Spectre Device modeling projects to speed up performance and enhance reliability aging models for specific device types.
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Java Tech Lead
Amat
Bangalore,IND, IN
7mo
Lead the design, development, and delivery of complex software solutions for semiconductor and display equipment components.
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Software Engineer for SPICE (math)
Cadence
BEIJING
7mo
Developing mathematical and probabilistic algorithms to enhance the accuracy, robustness, and performance of simulation and analysis tools for next-generation EDA technologies.
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AI/CAD Software Engineer
Falcomm
Atlanta, Georgia, United States
7mo
Develop AI-driven tools to automate RF hardware design, optimize Power Amplifier (PA) performance, and accelerate tape-out processes.
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ML/AI Software Engineer
Cadence
SHANGHAI
7mo
Domain: Electro-thermal / Electromagnetic / Structural simulations Preferred skills: Electrical Engineering, Computer Science, AI project experience, PhD degree
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Application Engineer
Cadence
YOKOHAMA
7mo
Provide technical support for Cadence's advanced software tools used for designing and verifying semiconductor and electrical/electronic systems.
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Front-End Manufacturing Engineering Production Supervisor
Micron
Taoyuan - Fab 11, Taiwan
7mo
Lead front-end manufacturing production line performance, focusing on designated areas to ensure alignment and continuous improvement of production processes.
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Intern
Cadence
CORK 01
8mo
Implementing microprocessor cores and multiprocessor sub-systems in RTL for Xtensa processors, focusing on timing, area, and power goals for intelligent IoT devices.
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Senior/Staff/Principal Engineer, Product Engineering
Micron
Hyderabad - Phoenix Aquila, India
8mo
Develop, validate, characterize, and qualify new state-of-the-art NAND Flash memory products through post-silicon validation and test program development.
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software engineering intern
Cadence
BEIJING
8mo
Research and develop new technology to speed up large-scale transistor-level post-layout circuit simulation within the Spectre FX (FastSPICE) circuit simulator.
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Senior Modeling Engineer
Analogdevices
India, Bangalore, Nova
8mo
Lead the definition, development, and maintenance of system-level models for high-speed RF converter-based products and RF integrated transceivers to support architecture exploration, performance analysis, and design validation.
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Frontend Organizations Central Team, Staff / Principal Photo Scanner Engineer
Micron
Fab 10A, Singapore
8mo
Provide deep technical and operational leadership to drive best-in-class photo scanner performance, uptime, utilization, and productivity across the global Micron manufacturing network.
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Senior Design Engineer
ON Semiconductor
Bangalore, Karnataka, India
8mo
Developing digital blocks and automation frameworks for power management products including DC-DC PMIC, multiphase controllers, and SiC drivers.
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Principal Engineer/MTS – Member of Technical Staff, HIG-HBM Product System Engineering (Media Health Manufacturing)
Micron
Fab 10A, Singapore
8mo
Lead manufacturing test flow development, validation, and yield improvement for High Bandwidth Memory (HBM) products across DRAM, Interface, and Stacked Die architectures.
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Principal Engineer/MTS – Member of Technical Staff, HIG-HBM Product System Engineering (Media Health Reliability)
Micron
Fab 10A, Singapore
8mo
Spearhead and develop a high-performing team driving intrinsic and extrinsic reliability test development and execution for Micron's latest High Bandwidth Memory (HBM) products.
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Staff Engineer, Package Development & Engineering
Micron
MSB, Singapore
8mo
Providing technical leadership and strategic oversight for advanced packaging initiatives to drive technology enablement, yield acceleration, and integration of next-generation packaging solutions.
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Calibre LVS Principal Software Engineer
Siemens-Eda
Wilsonville, OR, United States
$130k–$130k
8mo
Design, develop, and optimize features for Calibre LVS/DRC tools to ensure accuracy, performance, and usability in electronic design automation.
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Manager, Planning Digital Twin
Micron
Fab 10A, Singapore
8mo
Lead a team to deliver business value through advanced analytics and data-driven solutions for strategic planning and operational excellence in the semiconductor industry.
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MTS/Principal Engineer, Wet Process Engineering, NAND Advance Node
Micron
Fab 10N/X, Singapore
8mo
Lead process development for WET processes in NAND memory technology, performing experiments, material/chemical characterization, and process integration.
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Firmware Field Application Engineer_Taipei
MediaTek
Taipei
8mo
Supporting MediaTek scaler SoC monitor projects by implementing monitor functions and applications for customers.
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<Data center>System Architect Design Engineer
MediaTek
HsinChu
8mo
Define architecture and specifications for high-speed UCIE development through simulations and verification.
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R&D Senior Hardware Developer
Hitachi
Vaesteras, Vastmanland County, Sweden
8mo
Lead and oversee the development of class-leading hardware solutions for protective relays, managing the full project lifecycle from concept to delivery.
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<Data center>System Expert for Post-silicon
MediaTek
HsinChu
8mo
Developing system firmware, high-speed physical layer data transmission software, and optimizing hardware performance for customized ICs in Enterprise/AI/xPU industries.
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Electron Optics Devices Software Engineer
Amat
Rehovot,ISR
9mo
Develop and maintain device drivers and platform flows for advanced semiconductor inspection tools that interface with real hardware.
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Java Tech Lead
Amat
Bangalore,IND, IN
9mo
Lead the design, development, and launch of new software features and enhancements for semiconductor equipment components and devices.
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Design Verification DDR Lead
MediaTek
Bangalore
9mo
Develop and implement comprehensive verification plans, testbenches, and environments for HBM4/4e IP and Subsystem using SystemVerilog and UVM.
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SoC Front End Design Engr
Nxp
Noida
9mo
Design and develop complex System-on-Chip (SoC) architectures for next-generation automotive and IoT products.
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Wireless Communication System Digital IC Design Engineer
MediaTek
ChuPei
9mo
Design, develop, and verify digital circuits for wireless communication systems like WiFi and modem baseband.
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Software Engineering Intern
Kla
Ann Arbor, MI
$0k–$0k
10mo
Intern working with AI and Modeling Center of excellence to improve KLA products using machine learning, deep learning, and physics modeling.
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