Mechanical Simulation Engineer – Advanced Packaging
Core
Drive thermo-mechanical and multiphysics modeling for advanced semiconductor packaging technologies including HBM, 2.5D, and 3D integration to enable robust package design.
Role type
Mechanical Simulation Engineer (Advanced Packaging)
Builds
Predictive simulation methodologies and design decisions for HBM, 2.5D/3D packages, TSV, and hybrid bonding technologies.
Domain
Semiconductor manufacturing / Advanced Packaging
Deliverable
production ML models
Required skills
Linear and non-linear static analysis, fatigue and fracture mechanics simulation, multiphysics modeling (thermo-mechanical, thermal, structural, fluidic), contact and delamination modeling, Generative AI and AI Assistant integration, AI/ML for surrogate and reduced-order modeling, automation workflow development, material characterization, failure and reliability analysis.
Preferred skills
AI-driven modeling, automation, data-driven simulation techniques.
Technologies
Generative AI, AI Assistant tools, AI/ML frameworks, simulation automation tools.
Responsibilities
Perform linear and non-linear static analysis for package and material behavior; Conduct fatigue, fracture mechanics, and reliability simulations; Develop multiphysics models; Model interfaces including contact, shear, delamination, and interfacial damage; Integrate Generative AI and AI tools for simulation acceleration; Apply AI/ML techniques for surrogate modeling and design optimization; Develop and deploy automation workflows; Support development of HBM, 2.5D/3D packages, TSV, and hybrid bonding technologies; Understand fabrication and assembly processes; Develop material models for polymers, composites, and thin-film stacks; Drive material characterization workflows; Perform failure and reliability analysis.
Seniority
Mid-level (2-5 years experience)
