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Hardware & Physical Engineering
› Semiconductor Process Engineering
Semiconductor Process Engineering
3,503 open positions
Laser Semiconductor Engineer
Lumentum
Japan - Sagamihara
5mo
Develop core technologies for next-generation optical devices, focusing on advanced performance and scalable architectures.
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Senior Wets Process Development Engineer (R&D)
Stmicroelectronics
Singapore, Singapore
5mo
Technical anchor for end-to-end wet process portfolio, designing and optimizing plating, etching, and cleaning modules for semiconductor manufacturing.
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Dry Etch - DMTS, PD, Advance NAND
Micron
Fab 10N/X, Singapore
5mo
Senior individual contributor leading advanced dry etch process development and technology roadmap for Next Generation NAND memory.
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RFAB Module Industrial Engineer
Texas Instruments
Richardson, TX, United States
5mo
Industrial Engineer supporting manufacturing operations, process planning, and capacity analysis to optimize output and cycle time.
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Sr Engineer Process Engineering
GlobalFoundries
Singapore
5mo
Develops and modifies process formulations, methods, and controls to meet quality standards in a semiconductor fabrication environment.
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Distinguished Member of Technical Staff, NAND Advanced Thin Films Process Development
Micron
Fab 10N/X, Singapore
5mo
Shape technical vision and lead breakthrough innovations in structural and electrical film processes for next-generation NAND memory.
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Member of Technical Staff, NAND Advanced Thin Films Process Development
Micron
Fab 10N/X, Singapore
5mo
Lead project-level initiatives for developing structural and electrical thin film processes (dielectric and carbon-based) for NAND memory technology.
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Upgrade Install and Relocation Engineer
ASML
Beijing, China
5mo
Executes system Upgrade, Installations, and Relocations for ASML lithography systems at customer sites, including hardware assembly, alignment, testing, and procedure execution.
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Dry Etch - MTS, PD, Advance NAND
Micron
Fab 10N/X, Singapore
5mo
Lead critical modules in Next Generation NAND research and development Dry Etch technology, operating chambers and managing process roadmaps to achieve yield goals.
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NTI NAND Senior/Principal Process Integration Engineer
Micron
Fab 10N/X, Singapore
5mo
Designing, developing, integrating, and implementing process solutions to improve next-generation 3D NAND product yield and quality.
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NTI Equipment Development Engineer, Real-Time Defect Analysis (RDA)
Micron
Fab 10N/X, Singapore
5mo
Develop and optimize real-time defect analysis (RDA) equipment and processes to identify and resolve systematic and random defects in semiconductor manufacturing.
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Technician 3, Production
Semtech
USA - Alhambra, CA
$56k–$56k
5mo
Execute and maintain wafer fabrication processes for InP-based photonic devices including DFB lasers and gain chips.
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Senior Product Development Engineer
Analogdevices
Malaysia, Penang
5mo
Lead new product development projects from concept to production, focusing on substrate technology and assembly requirements.
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Process Engineer
Amat
Santa Clara,CA
$100k–$100k
5mo
Designing and optimizing manufacturing processes for display and semiconductor technologies, including data analysis, hardware characterization, and troubleshooting.
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Process Engineer – Die to Wafer Hybrid Bonding
Amat
Santa Clara,CA
$147k–$147k
5mo
Developing and optimizing die-to-wafer hybrid bonding processes for silicon photonics and co-packaged optics to enable photonic-electronic co-integration for AI and HPC systems.
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Principal Engineer, NAND TD, RDA
Micron
Fab 10N/X, Singapore
5mo
Lead a team in using next-generation defect detection equipment and processes to identify and solve issues, accelerating technology transfer in Technology Development.
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Change Management Engineer
Micron
Boise, Idaho, United States of America
5mo
Align, optimize, and troubleshoot system setup and operation procedures for Global Process Control, Traveler Control, Information Systems, and production.
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ENGR SR, DEVICE; MFG
ON Semiconductor
Negeri Sembilan, Malaysia
5mo
Senior Device Engineer supporting ISMF manufacturing ramp, ensuring stable device performance, and driving yield improvements across device, process, and probe test activities.
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Principal Process Engineer
ON Semiconductor
Seremban, Negeri Sembilan, Malaysia
5mo
Senior technical leader driving project leadership and deep subject matter expertise in post-Fab wafer processing (backgrind, thinning, metallization) to optimize manufacturing performance and ensure product reliability.
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Equipment Maintenance Technician
Polarsemi
Bloomington, MN, USA
$58k–$58k
5mo
Monitor, sustain, and improve Front-End-of-Line (FEOL) semiconductor manufacturing equipment in a cleanroom environment to ensure peak performance and process stability.
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F15 HVM CVD Equipment Engineer
Micron
Hiroshima - Fab 15, Japan
5mo
Implement, maintain, and troubleshoot CVD equipment to ensure flawless operation and minimize downtime in a manufacturing environment.
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Sr. Process Engineer /Process Engineer (Taoyaun)
Micron
Taoyuan - Fab 11, Taiwan
5mo
Lead process and equipment improvement projects for semiconductor manufacturing modules, optimizing yield, cost, and cycle time through data analysis and practical execution.
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Experienced Field Application Engineer
GlobalFoundries
Sofia
6mo
Field Application Engineer supporting semiconductor customers through design-in and new product implementation phases, ensuring successful tape-out and NPI execution.
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Dry Etch Senior Engineer, Advance NAND
Micron
Fab 10N/X, Singapore
6mo
Developing and optimizing dry etch processes for next-generation NAND memory to meet physical and electrical requirements.
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Principal Equipment Engineer (Multiple Positions) #9938
TSMC
USA-Arizona
6mo
Retrofit component and parameter settings to improve tool performance and availability for diffusion, thin film, lithography, or etching equipment in a clean room environment; install and qualify new tool sets to add capacity.
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Cleans Equipment Technician - Days
Samsung Electronics
1530 FM 973 Taylor, TX, USA
$0k–$0k
6mo
Perform preventative maintenance, troubleshooting, and process monitoring for semiconductor manufacturing equipment and systems to produce memory chips and logic devices.
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Package technology Reliability senior engineer/Technical manager
MediaTek
HsinChu
6mo
Conducting risk assessments and reliability management for 2.5D/3D/CPO advanced packaging and board-level qualification.
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Hardware (HW) Qualification and Development Support Team (DST) Engineer IV
Amat
Santa Clara,CA
$161k–$161k
6mo
Lead qualification of complex, non-system components and support R&D module integration, calibration, and qualification for semiconductor and display manufacturing equipment.
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RDA and Metrology Central Team Engineer
Micron
Hiroshima - Fab 15, Japan
6mo
Establishing and optimizing detection systems for RAM manufacturing to ensure 100% inline visibility and control, improving yield, quality, and cost.
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Dry Etch Principal Engineer/ MTS Lead, Process Development, Advance NAND
Micron
Fab 10N/X, Singapore
6mo
Leading process development for next-generation NAND dry etch technology, managing R&D teams, and driving yield improvements for advanced memory products.
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RDA and Metrology Central Team Engineer
Micron
Hiroshima, Japan
6mo
Establish and optimize detection systems and strategies for RAM manufacturing to ensure 100% inline visibility and control, driving yield improvement and cost reduction.
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Photolithography Staff/Sr Engineer, Process Development, Advanced NAND
Micron
Fab 10N/X, Singapore
6mo
Develop unit processes for next-generation memory devices, optimize cell yield, and drive technology transfers to manufacturing.
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MFG ME CV AME ENG
Micron
Hiroshima - Fab 15, Japan
6mo
Optimizing semiconductor manufacturing processes, equipment parameters, and production capacity to maximize output and reduce cycle time.
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MFG MXT ENGINEER
Micron
Hiroshima - Fab 15, Japan
6mo
Lead MXT (MaxOut) projects to optimize semiconductor manufacturing capacity, throughput, and cycle time through process modeling and cross-fabric collaboration.
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Photolithography DUV Equipment Engineer
Micron
Hiroshima - Fab 15, Japan
6mo
Operate, maintain, and optimize ASML DUV photolithography scanners to improve equipment utilization, yield, and process capability in semiconductor manufacturing.
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Principal Diffusion Process Development Engineer, DRAM
Micron
Boise, ID - Main Site
6mo
Leading FEOL diffusion, annealing, and gate oxidation process advancement for advanced DRAM devices, focusing on gate dielectric scaling and manufacturing readiness.
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Facility 超純水/排水処理エンジニア 超純水/排水処理エンジニア
Micron
Hiroshima - Fab 15, Japan
6mo
Ensuring stable operation of ultrapure water manufacturing and wastewater treatment facilities while optimizing water usage and reducing operational costs for semiconductor manufacturing.
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CVD/PVD Process Equipment Engineer
Micron
Hiroshima - Fab 15, Japan
6mo
Maintain production line health and optimize PVD processes for semiconductor wafer production to enhance product quality, yield, and capacity.
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Engineer CE PYE (Physical Failure Analysis/Fault Isolation)
Micron
MSB, Singapore
6mo
Perform sophisticated electrical device characterization, operate fault isolation equipment, and conduct physical failure analysis to identify, classify, and root-cause defects in memory devices.
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PHOTO Process Engineer
Micron
Hiroshima - Fab 15, Japan
6mo
Develop and optimize photolithography processes for new semiconductor products and technologies.
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Manufacturing Test & Production Engineer
Etchedai
Hardware Engineering
6mo
Design and implement test stations and production line flows for advanced AI ASICs to ensure high yield, quality, and throughput.
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Lead RTP Module Technician - Night Shift
ON Semiconductor
Hopewell Junction, NY, United States
$0k–$0k
6mo
Lead technician guiding training and troubleshooting on 300mm automated semiconductor equipment (AMAT Vantage and Centura systems) in a night shift role.
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ADTJ ATE Diffusion Engineer
Micron
Hiroshima - Fab 15, Japan
6mo
Establish and improve process conditions and technology for semiconductor equipment to achieve yield improvement and cost reduction in memory manufacturing.
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Advanced Technology Japan Engineer, CVD/PVD
Micron
Hiroshima - Fab 15, Japan
6mo
Establishing and optimizing semiconductor manufacturing processes (CVD/PVD) to improve product quality, yield, and cost efficiency.
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Fab15 WET Process & Equipment Engineer
Micron
Hiroshima - Fab 15, Japan
6mo
Maintain semiconductor production line health and optimize WET processes to remove particles and films using chemicals, gases, and steam.
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Photolithography Scanner DUV Equipment Engineer
Micron
Hiroshima - Fab 15, Japan
6mo
Operate, maintain, and optimize ASML DUV photolithography scanners to enhance equipment utilization, ensure efficient performance, and support semiconductor manufacturing processes.
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Metro RDA Senior Manager (Package Development for Advanced Packaging)
Micron
Fab 10A, Singapore
6mo
Strategic leadership for Metro RDA Process & Equipment (PDE) organization to drive process control, equipment capability, and manufacturing readiness for advanced packaging and New Product Introduction (NPI) environments.
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NPI Alignment Engineer
Aeva
Mountain View, CA
6mo
Develop precision optoelectronic active alignment equipment from concept to production release for micro-optic assembly.
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2026 Summer Intern - Physics & AI modeling Engineering
Amat
Santa Clara,CA
6mo
Physics-AI modeling engineering for materials science and chip/display manufacturing equipment.
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Manager Mechanical Engineer
Amat
Bangalore,IND
6mo
Manage engineering group and lead R&D for maintenance tooling, modules, and system designs for OLED evaporation systems and large-format glass substrate handling.
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