Failure analysis Development Engineer (Shift role)
Core
Investigate yield and reliability issues on advanced microprocessors, graphics processors, and heterogeneous integration products using end-to-end failure analysis and material characterization.
Role type
Senior IC failure analysis engineer (semiconductor)
Builds
Advanced microprocessors, graphics processors, and heterogeneous integration products (SoIC)
Domain
Semiconductor manufacturing / Advanced node (3nm FinFET and below)
Required skills
Failure analysis, device physics, materials characterization, FIB, TEM, AFM, electron microscopy, nano-probing, sample preparation, root cause analysis
Preferred skills
Mentoring junior engineers, semiconductor wafer processing background, fabless or wafer fab experience, tool troubleshooting
Technologies
FIB, TEM, AFM, electron microscopy, nano-probing, plasma FIB, SoIC
Responsibilities
Perform transistor nano-probing and electrical characterization; Prepare advanced sample preparation for SoIC and heterogeneous integration products; Prepare site-specific TEM lamellae using focused ion beam; Conduct plasma FIB sample preparation and yield failure analysis; Follow laboratory safety and EHS procedures; Support continuous improvement and automation initiatives
Seniority
Senior, hands-on IC
