Senior Staff Engineer Unit Process Engineering
Core
Serve as process owner and technical expert for Wafer Backgrind, Laser Groove, and Wafer Dicing/Saw processes, driving yield improvement, defect reduction, and process optimization.
Role type
Senior Staff Engineer, Unit Process Engineering
Builds
Semiconductor manufacturing processes for power systems and IoT solutions
Domain
Semiconductor manufacturing / Wafer processing
Required skills
DOE, Statistical analysis (SPC, Cp/Cpk, FMEA), Root cause analysis (8D, 5 Why, Fishbone), Data analysis (JMP, Minitab, Excel), Technical leadership, Process optimization
Preferred skills
Wafer Sawing and Laser Groove process experience, Semiconductor industry background (10+ years)
Technologies
JMP, Minitab, Excel, SPC, DOE, FMEA, 8D, 5 Why, Fishbone
Responsibilities
Own and manage Backgrind, Laser Groove, and Saw processes; Lead yield and defect improvement projects; Drive process optimization using statistical methods; Lead root cause investigations; Coach and mentor junior engineers and technicians
Seniority
Senior Staff, hands-on IC with mentorship