Capital Equipment Hardware engineer - Advanced Packaging
Core
Support installation, startup, qualification, and ongoing operation of the Kinex™ Hybrid Bonding platform for advanced packaging development programs.
Role type
Senior IC Capital Equipment Hardware Engineer (Advanced Packaging)
Builds
Kinex™ Hybrid Bonding platform for die-to-wafer hybrid bonding, optical interconnect, and next-generation heterogeneous integration
Domain
Semiconductor manufacturing equipment / Advanced packaging
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Semiconductor equipment support, system integration, startup execution, facilities coordination, vendor engagement, mechanical/electrical/automation troubleshooting, root cause analysis, preventative maintenance, process readiness
Preferred skills
Advanced packaging equipment, hybrid bonding, wafer bonding, die attach, wet clean processes, facilities hookup, utility integration, automated material handling, vacuum systems, plasma processing, metrology systems
Technologies
Kinex™ Hybrid Bonding platform, BESI equipment, 300 mm equipment
Responsibilities
Support installation from tool dock through release to engineering users; Coordinate Tier 0, Tier 1, and Tier 2 startup activities; Perform troubleshooting of mechanical, electrical, automation, and process-related issues; Act as primary technical interface with product engineering teams; Support hybrid bonding process development activities
Seniority
Mid-Senior, hands-on IC
