Senior Die Bond/Die Attach Equipment Engineer
Core
Evaluating, selecting, ordering, installing, modifying, upgrading, maintaining, and troubleshooting die bond/die attach manufacturing equipment to ensure uptime and process reliability.
Role type
Senior IC equipment engineer (die bond/die attach)
Builds
Semiconductor manufacturing equipment and processes
Domain
Semiconductor manufacturing / Die bonding and die attaching
Deliverable
infrastructure
Required skills
Equipment evaluation and selection, installation and modification, preventative maintenance scheduling, performance and reliability analysis, technical support for repair teams, safety compliance
Preferred skills
null
Technologies
null
Responsibilities
Evaluate and select cost-effective equipment for product manufacture; oversee installation, modification, upgrade, and maintenance of manufacturing equipment; study equipment performance and reliability; establish programs to increase uptime and solve equipment problems; provide technical support to manufacturing equipment repair and process engineering organizations; define and write preventative maintenance schedules
Seniority
Senior, hands-on IC