Packaging Engineer
Core
Drive supplier engagement in external Flip Chip bumping/fan out/RDL/on substrate assembly manufacturers to deliver key performance indices on yield and excursion-free capabilities.
Role type
Senior IC Packaging Engineer (Backend Manufacturing)
Builds
Semiconductor ASIC packages (Flip Chip, RDL, Fan Out)
Domain
Semiconductor manufacturing / Advanced packaging
Required skills
Supplier engagement, New Product Introduction (NPI) planning, Issue resolution and prevention, Change management, Continuous improvement, Yield monitoring, Cross-functional project management, Analytics and troubleshooting
Preferred skills
Flip Chip assembly, Bumping/fan out/RDL process knowledge, Failure analysis, Package reliability, ESD/Jedec/Automotive standards, JMP/Minitab/AI agents
Technologies
JMP, Minitab, AI agents
Responsibilities
Drive supplier engagement on continuous improvement and new capabilities; Plan and drive New Product Introduction activities and Ramp Up readiness; Monitor external manufacturing site performance regarding yield and outliers; Execute change management; Proactively identify improvement opportunities for process simplification and quality enhancement; Support on-site audits and travel.
Seniority
Senior, hands-on IC
