Senior Engineer, Process Integration, Advanced NAND
Core
Lead the integration of cutting-edge 3D NAND technology and develop a strategic technology roadmap for the next 5+ years.
Role type
Senior IC process integration engineer (3D NAND)
Builds
3D NAND memory devices and storage solutions
Domain
Semiconductor manufacturing / Memory storage
Deliverable
production ML models
Required skills
3D NAND process integration, device architecture, experimental design, statistical modeling, data analysis, model-based problem solving, patent generation
Preferred skills
Machine learning, electrical metrics analysis, inline metrics analysis, structure-to-electrical correlations
Technologies
3D NAND, electrical metrics, inline metrics
Responsibilities
Lead integration of cutting-edge 3D NAND technology; Identify and evaluate critical technology gaps; Define construction specifications based on electrical and inline metrics; Design, execute, and analyze experiments to meet engineering specifications; Solve complex problems using a model-based approach and promote technical innovation through process improvements and patent generation
Seniority
Senior, hands-on IC