Engineer, Product & System Engineering (Media Health Manufacturing), Heterogenous Integration - High Bandwidth Memory
Core
Drive Media Health Manufacturing and activities for Micron's latest Heterogeneous Integration High Bandwidth Memory (HBM) products, focusing on DRAM, Interface die, and stacked products.
Role type
Senior IC Product & System Engineering (HBM Manufacturing)
Builds
Next-generation HBM products for data center and AI applications
Domain
Semiconductor manufacturing (HBM, DRAM, CMOS)
Required skills
HBM architecture, DRAM architecture, CMOS technology, device physics, circuit debug, test coverage optimization, DFT strategy, root cause analysis, yield improvement, project management, cross-functional collaboration
Preferred skills
Semiconductor devices, circuit design, product validation, data analysis, statistics, Python, JMP
Technologies
CAD tools, Verilog simulations, Python, JMP
Responsibilities
Ensure optimized test coverage on current and future HIG HBM design architectures; Develop, validate, characterize, and qualify next-generation HBM products; Support design verification and in-depth circuit analysis using CAD tools and Verilog simulations; Improve manufacturing test yields and reduce test time; Resolve root causes of manufacturing test flow, qualification, and RMA device issues; Promote innovation to provide technical advantages; Make technical decisions on risk analysis and project prioritization; Collaborate with cross-functional teams (Fab, Design, Test, Quality/Reliability). (via careerplan.io/jobs/37811826-engineer-product-system-engineering-media-health-manufacturing-heterogenous-integration-hi)
Seniority
Senior, hands-on IC