Silicon Packaging Design Architect
Core
Design end-to-end silicon package solutions for physical, electrical, and cost requirements, ensuring seamless transition to production.
Role type
Senior IC silicon packaging design architect
Builds
Advanced packaging solutions for Intel's cutting-edge silicon technologies
Domain
Semiconductor manufacturing / Advanced packaging
Required skills
Semiconductor fabrication, chip assembly, packaging design, electromagnetic simulation, PCB layout, design for test, technology tradeoff analysis, cross-functional collaboration
Preferred skills
10+ years in package/PCB/IC design, cost optimization, complex design troubleshooting, multidisciplinary team leadership
Technologies
Mentor, Cadence, SPICE, Ansys, Allegro, Xpedition, Hyperlynx, Sigrity, Concept HDL, APD/SiP
Responsibilities
Translate product requirements into package architecture specifications; drive technology tradeoff decisions for electrical/mechanical/thermal/reliability standards; oversee end-to-end package development and quality improvements; troubleshoot designs and resolve material/process issues; implement co-design strategies between silicon and board teams; collaborate with EDA partners to advance design tools.
Seniority
Senior, hands-on IC
