<Data center>Senior Package Integrator
Core
Lead the development of advanced packaging solutions including CoWoS, 2.5D/3.5D integration, and chiplet-based architectures.
Role type
Senior IC advanced packaging engineer
Builds
Advanced semiconductor packaging solutions for SoCs
Domain
Semiconductor manufacturing / Advanced packaging
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
SoC floorplanning, PPA optimization, timing analysis, congestion management, power-domain boundary definition, PDN design, thermal management, ball/bump map definition, SI/PI analysis, manufacturability assessment, reliability engineering
Technologies
CoWoS, 2.5D/3.5D integration, chiplet architectures
Responsibilities
Coordinate cross-functional alignment on technical requirements and interfaces for packaging solutions; Lead SoC floorplanning to optimize PPA; Partner with the package team to define and refine ball/bump maps meeting SI/PI and reliability requirements
Seniority
Senior, hands-on IC
