Advanced Package Design Engineer
Core
Design and optimize high-performance, high-density interposers for chiplet-based architectures and heterogeneous integration solutions.
Role type
Senior IC advanced package design engineer
Builds
Robust, manufacturable, and cost-effective advanced packaging solutions for semiconductor chips
Domain
Semiconductor manufacturing / Advanced packaging
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
EDA tools (Virtuoso/APD, Synopsys Custom Compiler, Siemens Xpedition), high-speed signal routing, power distribution networks (PDN), 2.5D/3D packaging technologies, substrate design rules, large body substrate technologies
Preferred skills
SI/PI simulation (Ansys, HFSS, ADS), advanced packaging materials analysis, failure mechanisms, analytical techniques
Technologies
Virtuoso, APD, Synopsys Custom Compiler, Siemens Xpedition, Ansys, HFSS, ADS
Responsibilities
Design silicon and organic interposers for advanced packaging solutions; Perform design studies and what-if scenario analysis to optimize package design; Create and maintain layout design rules, stack-ups, and guidelines; Collaborate with PCB, SI/PI, thermal, and manufacturing teams
Seniority
Mid-level, hands-on IC
