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Senior Engineer

Bengaluru, India💼 Full-time🗓 2026-05-11 → 2026-07-22

Core

Define, design, and verify package designs for 2.5D and 3D package systems, focusing on Signal and Power Delivery Networks.

Role type

Senior IC electrical engineer (package design)

Builds

2.5D and 3D package systems

Domain

Semiconductor packaging / Electrical Engineering

Deliverable

production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work

Required skills

Electrical Engineering degree, 2.5D and 3D package systems design, SI/PI requirements analysis, Cadence APD, Cadence Allegro, DFM, DFA

Preferred skills

EDA vendor collaboration, tool evaluation, Python programming, SKILL programming, TCL programming, design methodology optimization

Technologies

Cadence APD, Cadence Allegro, Python, SKILL, TCL

Responsibilities

Define, design, and verify package designs; create layouts using best-known practices for DFM, DFA, Signal and Power Delivery Networks; coordinate with external vendors; facilitate standardization across the department

Seniority

Senior, hands-on IC

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