3DIC Advance Package Design Engineer
Core
Developing and enhancing design methodologies, flows, and interposer designs for 2.5D and 3D IC advanced packages.
Role type
Senior IC advance package design engineer
Builds
2.5D and 3D IC advanced packages, interposers, and test vehicles
Domain
Semiconductor manufacturing / 3D IC integration
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
3DIC development, ASIC (APR) design, flow development, EDA enablement, physical quality assurance, electrical quality assurance, thermal quality assurance, tool roadmap definition, interposer design
Responsibilities
Contribute to the development and enhancement of design methodologies for 2.5D and 3D IC advanced package design; Lead the development of new design and signoff flows for physical, electrical, and thermal quality assurance; Support package design teams in defining a tool roadmap for advanced package design; Contribute to interposer designs, advanced package designs, and test vehicles for the product design roadmap and feasibility; Represent the Package design team in customer engagements for advanced package designs
Seniority
Senior, hands-on IC
