Senior Staff Advanced Packaging Design Engineer
Core
Lead package design and architecture development for next-generation HPC, AI, and networking solutions, focusing on signal, power, thermal, and mechanical integrity of 2.5D/3D packages.
Role type
Senior Staff Advanced Packaging Design Engineer
Builds
High-performance multi-chip packages (CoWoS, EMIB, CPO, CPC) and advanced substrates for data infrastructure.
Domain
Semiconductor manufacturing / Advanced Packaging / HPC & AI
Required skills
Advanced packaging architecture (2.5D/3D), substrate/board design, DFM, signal/power integrity, HBM/DDR/SerDes technologies, cross-functional leadership
Preferred skills
Simulation interpretation, tool development, library maintenance
Technologies
Cadence 3DIC/ISP/APD/Sigrity/Innovus/Virtuoso, Ansys, AutoCAD, SolidWorks
Responsibilities
Lead small project teams to deliver packaging solutions; drive package definition and architecture for performance-line products; interface with suppliers to ensure manufactability and performance.
Seniority
Senior Staff, hands-on IC with leadership
