Staff Signal and Power Integrity Engineer
Core
Develop novel System-in-Package designs and electrical integrity solutions to enhance Arm IP performance.
Role type
Staff Signal and Power Integrity Engineer
Builds
System-in-Package designs and silicon/platform electrical integrity solution spaces
Domain
Semiconductor / Advanced Packaging / System-on-Chip
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
System level Signal Integrity, SIPI analysis environments (Ansys, Cadence), multi-port matrices (S, Y, Z parameters), electromagnetic extraction, technical direction
Preferred skills
SoC implementations, System level Power Quality Assurance, complete package build flow, packaging manufacturing steps, advanced packaging (2.5D, 3D), Linux scripting
Technologies
Ansys suite, Cadence
Responsibilities
Build and analyze novel System-in-Package designs, Deliver robust build methodologies and silicon/platform electrical integrity solution spaces, Develop innovative power delivery techniques and interfaces, Supervise package builds and run specific packaging analysis tools, Take on a tech lead position and deliver technical oversight to sub-workgroups
Seniority
Staff, hands-on IC with technical leadership