Advanced Packaging Design - SI/PI Engineer
Core
Signal and Power Integrity analysis and optimization for 2D/2.5D/3D semiconductor packages, including floor-planning, power delivery networks, and signal routing.
Role type
Senior IC Signal and Power Integrity Engineer
Builds
High-speed multi-chip packages and Co-packaged optics solutions
Domain
Semiconductor packaging and high-speed digital design
Required skills
Signal integrity analysis, Power integrity analysis, Circuit extraction, Simulation and analysis, Package design optimization, Floor-planning, Power delivery network design
Preferred skills
Interposer design, EDA simulation tools (Ansys HFSS, Keysight ADS, Cadence Sigrity), Package substrate design rules, Assembly rules
Technologies
PowerSI, SIwave, Ansys HFSS, Keysight ADS, Cadence Sigrity
Responsibilities
Perform SI/PI analysis and optimization within 2D/2.5D/3D packages, Interface with product design teams for optimized floor-planning and power delivery network design, Execute simulation tasks for signal and power integrity sign-off
Seniority
Senior, hands-on IC
