3D IC Solutions Engineer – Power, EMIR and Reliability
Core
Define and drive comprehensive workflow solutions for power, EMIR (Electromigration and IR-drop), and reliability analysis of 2.5D/3D IC package designs, acting as a technical product owner to translate customer requirements into software deliverables.
Role type
Senior IC Solutions Engineer (Power, EMIR, Reliability)
Builds
End-to-end workflow solutions integrating EDA and simulation tools for architectural planning, physical design, and signoff-to-manufacturing handoff analysis.
Domain
Semiconductor EDA / Advanced Packaging (2.5D/3D SiP)
Deliverable
production ML models
Required skills
EDA physical design and implementation, Power and EMIR analysis, Advanced Packaging EDA tools, Generative and agentic AI technologies, Technical collateral creation, Customer engagement
Preferred skills
MS in electrical or computer engineering, Experience with Siemens, Synopsys, or Cadence tools
Technologies
Siemens (Aprisa, PowerPro, mPower), Synopsys (3DIC Compiler, Fusion Compiler), Cadence (Integrity 3D-IC, Innovus, Voltus, Voltus-XFi, Clarity 3D solver), Ansys (Redhawk, Totem, Swave), Verilog, LEF/DEF, GDS, OASIS
Responsibilities
Translate roadmap priorities and customer requirements into software deliverables, Provide technical support and guidance to sales, marketing, and design services organizations, Represent Siemens EDA in direct customer engagements, Generate high-quality technical marketing content (papers, demos, videos), Develop proof-of-concept demonstrators using generative AI
Seniority
Senior, hands-on IC
