Senior High-Speed PCB Engineer - TeraWave
Core
Lead physical design of complex, multi-layer PCBs for the TeraWave network switch platform, focusing on signal integrity, power integrity, and high-speed interface implementation.
Role type
Senior IC high-speed PCB engineer
Builds
TeraWave network switch platform PCBs for enterprise-grade satellite communications
Domain
Aerospace / High-speed digital design
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
High-speed PCB design, Signal integrity (SI) analysis, Power integrity (PI) design, DDR memory interface design, SerDes interface design, Electromagnetic compatibility (EMC) design, Design for Manufacturability (DFM), Design for Testability (DFT), 3D EM simulation, VNA/TDR measurement analysis
Preferred skills
Experience with microprocessors and SoCs (ARM, RISC-V, MPSoC), FPGA integration, High-speed connector and backplane optimization
Technologies
SerDes, DDR4/DDR5, 10GbE/25GbE/40GbE/100GbE, VNA, TDR, 3D EM simulation tools, AOI, X-ray inspection
Responsibilities
Lead physical design of complex, multi-layer PCBs; Perform pre- and post-layout SI/PI analysis and simulation; Design DDR and SerDes interfaces; Architect low-impedance power delivery networks; Apply DFM/DFT strategies; Lead hardware bring-up and validation testing.
Seniority
Senior, hands-on IC
