Staff Board - Package co-design Engineer
Core
Staff Board - Package co-design Engineer specializing in PCB & Silicon packaging co-design for Arm processors and SoC integration.
Role type
Staff IC board and package co-design engineer
Builds
Physical hardware platforms for software development and validation of Arm IP products
Domain
Semiconductor / Embedded Compute / High-speed electronics
Required skills
PCB and silicon package co-design, high-speed design and interface standards (PCIe, LPDDR), signal and power integrity analysis, escape routing analysis, PCB fabrication process knowledge (PTH, HDI, stackup), EDA tools (Cadence OrCAD & Allegro), system-level feasibility analysis
Preferred skills
Signal Integrity tools (ANSYS, Siemens EDA), design automation and scripting (via careerplan.io/jobs/99030825440-staff-board-package-co-design-engineer-at-arm)
Technologies
Cadence OrCAD, Cadence Allegro, PCIe, LPDDR, ANSYS, Siemens EDA
Responsibilities
Specify, evaluate, analyze and develop solutions for efficient PCB and silicon package integration; drive PCB development alongside chip packaging team including breakout and routing strategies; analyze and optimize signal paths to ensure signal quality; evaluate package pinout options against PCB routability and SI/PI performance; support early silicon and board architecture planning including component placement and PDN strategy
Seniority
Staff, hands-on IC with strategic influence
