Signal Integrity Engineer-1.6 OSFP Board Design
Core
Own board-level high-speed electrical design for 1.6T DR8 OSFP optical modules, from pre-layout simulations through validation and production support.
Role type
Senior IC Signal Integrity Engineer (high-speed board design)
Builds
1.6T OSFP optical modules with 200G PAM4 lanes for AI supercomputing infrastructure
Domain
Data center interconnects / Optical networking / High-speed PCB design
Deliverable
production ML models | product features
Required skills
Pre/post-layout SI simulations (time/frequency domain), PCB stack-up definition, transmission line theory, S-parameters, equalization (FFE/DFE/CTLE), jitter analysis, crosstalk mitigation, return path design, power distribution network design, lab measurement (TDR, VNA, BERT), fixture design/de-embedding
Preferred skills
OSFP/QSFP-DD/OSFP-XD module experience, high-speed optical component knowledge (drivers, TIAs, CDRs/DSPs), IEEE 802.3 DR8/FR8/LR8 standards, OIF/OTN ecosystem familiarity, EMI/EMC and thermal constraint management
Technologies
Sigrity, ADS, HFSS, SIwave, HSPICE
Responsibilities
Define PCB stack-up, materials, via technology, and routing rules to meet loss budgets; review schematics and layouts (diff-pair routing, reference transitions, stitching) and sign off on SI; perform lab bring-up and correlation using TDR, VNA, and eye/PAM4 analysis; drive SI-related root-cause debug on proto and production builds; generate SI/PI design guidelines and technical documentation
Seniority
Senior, hands-on IC
