Engineer, Semi Packaging Engineering
Core
Lead the design, development, and qualification of advanced semiconductor packaging solutions (wire-bond, flip-chip, SiP, modules) balancing reliability, manufacturability, and cost.
Role type
Senior IC packaging engineer
Builds
Semiconductor packaging solutions for autonomous vehicles, drones, factories, AR, and remote healthcare
Domain
Semiconductor manufacturing / Advanced packaging
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Semiconductor packaging development, package simulation, IC packaging materials knowledge, IC package structures, substrate technologies, semiconductor assembly processes
Preferred skills
ANSYS, FloTHERM, Sigrity, Icepak, SolidWorks, AutoCAD
Technologies
ANSYS, FloTHERM, Sigrity, Icepak, SolidWorks, AutoCAD
Responsibilities
Lead design and qualification of packaging solutions; Provide technical leadership in mechanical and thermal analysis; Collaborate with OSAT partners and suppliers to optimize processes; Work with quality teams to establish reliability criteria; Develop package design guidelines and technical documentation
Seniority
Mid-level, hands-on IC
