<Automotive>Automotive Packaging Engineer/Technical Manager
Core
Develop and evaluate advanced IC Package technology for automotive applications, managing new product introduction and mass production.
Role type
Senior IC packaging engineer / Technical Manager
Builds
Advanced IC Packages for automotive
Domain
Automotive / Semiconductor Packaging
Deliverable
production ML models | product features | infrastructure
Required skills
IC package technology development, supplier management, subcontractor collaboration, qualification processes, yield improvement, audit management
Responsibilities
Lead automotive packaging development from new product introduction through mass production, Develop and evaluate advanced IC Package technology, Collaborate with assembly subcontractors to complete technology development, Drive qualification and yield improvement for advanced IC Packages, Audit subcontractors
Seniority
Senior, hands-on IC