Senior Package Reliability Engineer

San Jose, California, United StatesFull-time$167k–$240k2026-07-16 → 2026-11-14

Based in United States

Core

Characterize and qualify advanced 2.5D/3D semiconductor packages by selecting packaging materials and developing thermal/thermomechanical finite element models to meet reliability requirements.

Role type

Senior IC semiconductor package reliability engineer

Builds

Advanced 2.5D/3D semiconductor packages for FPGA solutions

Domain

Semiconductor / Advanced Packaging / Thermal & Thermomechanical Analysis

Required skills

Thermal and thermomechanical simulation, Finite element modeling (FEM), Reliability statistics and failure analysis, Lifetime prediction modeling, Python scripting for automation, DFMEA development

Preferred skills

Correlation of simulations with dynamic warpage, Customer-facing risk assessment collaterals

Technologies

Ansys, Abaqus, COMSOL, Python

Responsibilities

Partner with development teams on packaging material selection, Develop and maintain thermal/thermomechanical FEM models, Execute reliability data collection strategies (coplanarity, warpage), Lead reliability evaluations per JEDEC/MIL-STD/IPC/AEC standards, Perform reliability lifetime prediction modeling, Develop DFMEA/FMEA documents

Seniority

Senior, hands-on IC

About Altera

At Altera™, our independence as the world's largest pure-play FPGA solutions provider gives us the focus, speed, and agility to innovate without compromise. With more than four decades of industry-leading FPGA expertise, our singular mission is to deliver the programmable technologies that help customers differentiate, innovate, and scale across rapidly evolving markets including AI, cloud, networking, communications, automotive, and edge computing. As an independent company, we move faster, invest deeper, and partner more closely—empowering our teams to drive breakthrough innovation and shape