Senior Package Reliability Engineer
Core
Characterizing and qualifying advanced 2.5D/3D semiconductor packages through thermal and thermomechanical analysis to ensure reliability for FPGA solutions.
Role type
Senior IC semiconductor package reliability engineer
Builds
Advanced semiconductor packages for AI, cloud, networking, and edge markets
Domain
Semiconductor industry, advanced packaging, thermomechanics
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
thermal and thermomechanical analysis, finite element modeling (FEM), reliability statistics, failure analysis, lifetime prediction modeling, Python scripting, DFMEA development
Preferred skills
understanding of 2.5D/3D flip-chip packages, correlating simulations with dynamic warpage, developing customer-facing risk assessment collaterals
Technologies
Ansys, Abaqus, COMSOL
Responsibilities
Partner with development teams on packaging material selection; develop and maintain thermal/thermomechanical FEM models; execute reliability data collection strategies; lead reliability evaluations per JEDEC/MIL-STD/IPC/AEC standards; perform lifetime prediction modeling; develop DFMEA documents
Seniority
Senior, hands-on IC
