Principal Engineer – Multi-Physics Sign-off (Timing, PDN & Thermal)
Core
Develop, enable, and support 3DIC and 2.5D physical design and signoff methodologies for advanced multi-die systems, covering timing, power, thermal, and multiphysics analysis.
Role type
Principal Engineer, Multi-Physics Sign-off (Timing, PDN & Thermal)
Builds
Robust, scalable, production-ready flows for 3DIC and 2.5D designs spanning floor planning through tapeout.
Domain
Semiconductor / Advanced Packaging / Multi-Physics Simulation
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
VLSI knowledge, 3DIC/2.5D design experience, cross-die constraint management, thermal analysis, scripting/automation, EDA tool qualification
Preferred skills
TSV/micro-bump/interposer expertise, Cadence Integrity 3D-IC, Synopsys 3DIC Compiler, Cadence Celsius, Ansys Icepak, Ansys RHSC-ET
Technologies
Cadence Integrity 3D-IC, Synopsys 3DIC Compiler, Cadence Celsius Thermal Solver, Ansys Icepak, Ansys RHSC-ET
Responsibilities
Develop and maintain CAD flows for 3DIC/2.5D designs; Enable STA methodologies for cross-die timing and closure; Support thermal analysis and CFD/FEM modeling; Build automation scripts to improve flow robustness; Collaborate with design, package, and EDA vendor teams.
Seniority
Principal, hands-on IC