Thermal Mechanical Test Engineer, Silicon Packaging (Starlink)
Core
Develop and execute thermal and mechanical modeling and test programs for advanced semiconductor packaging and board-level assemblies to enable high-volume production of reliable Starlink hardware.
Role type
Thermal Mechanical Test Engineer (Silicon Packaging)
Builds
Starlink satellite hardware and consumer dishes
Domain
Aerospace / Semiconductor Packaging
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
thermal and mechanical finite element modeling, thermal simulation, board-level thermal characterization, test campaign execution, test equipment operation and maintenance, data analysis and correlation, cross-functional collaboration
Preferred skills
mechanical engineering or materials science background, advanced degree, thermocouple mapping, power dissipation testing, infrared thermography, 3D and reduced-order modeling, IC packaging thermal resistance characterization, Python or MATLAB proficiency, high-volume manufacturing experience
Technologies
ANSYS, Abaqus, COMSOL, Flotherm, Icepak
Responsibilities
Develop and run thermal and mechanical finite element models and simulations; Design, set up, and execute thermal and mechanical test campaigns; Operate and maintain thermal chambers and instrumentation; Analyze test data and correlate models with empirical results; Support new package and board designs through test planning and execution
Seniority
Entry-level to Mid-level, hands-on IC