Advanced Packaging Reliability Engineer
Core
Lead reliability engineering for advanced packages used in high-performance AI and computing systems, focusing on mechanical and thermal risk assessment, modeling, and failure analysis.
Role type
Senior IC package reliability engineer
Builds
Advanced HPC packages for OpenAI's supercomputing platform
Domain
Semiconductor advanced packaging / AI hardware
Deliverable
production ML models | product features | infrastructure
Required skills
semiconductor package reliability principles, electromigration analysis, solder-joint fatigue assessment, root-cause analysis, thermal finite-element modeling, mechanical finite-element modeling, package-material behavior analysis, 2.5D/3.5D integration knowledge, interposer design, HBM integration, warpage prediction, stress/strain analysis, creep analysis, via failure analysis, dielectric cracking analysis, material degradation assessment
Preferred skills
electromigration lifetime modeling, interconnect lifetime modeling, package qualification methods, thermal cycling testing, power cycling testing, current-stress testing, reliability lifetime extrapolation, acoustic microscopy, X-ray imaging, cross-sectioning, scanning electron microscopy, voltage regulation support, high-current power delivery support
Technologies
FEA tools, acoustic microscopy, X-ray imaging, SEM, cross-sectioning equipment
Responsibilities
Lead reliability test plan and assessments for advanced HPC packages, drive reliability-focused package design optimization based on thermo-mechanical modeling, develop and apply package reliability models and lifetime-prediction methodologies, evaluate and recommend package architectures and assembly processes, predict electromigration lifetime of package interconnects
Seniority
Senior, hands-on IC