CareerPlanGet AI match score →

Senior Packaging Engineer

Chengdu - China💼 Full-time🗓 2026-07-20 → 2026-07-31

Core

Develop total package solutions including design, process development, qualification, and troubleshooting for integrated power semiconductors.

Role type

Senior Packaging Engineer (Semiconductor)

Builds

Integrated power semiconductor packages and systems

Domain

Semiconductor / Power Delivery

Deliverable

production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work

Required skills

lead frame design, substrate design, wire bonding, flip chip, Al wire, clip assembly, assembly process development, NPI, root cause analysis, defect identification, material characterization (epoxy, solder, EMC), CAD/SolidWorks, thermal characterization, stress characterization

Preferred skills

frame/substrate design, thermal and stress characterizations, CAD/SolidWorks

Responsibilities

Provide package solutions and material selection for various assembly types; handle assembly process and FA quality issues; lead new package/process/material development from concept to mass production.

Sourced via workday · Listed on CareerPlan, which tracks 70,000+ jobs from 20+ sources.
Apply on Workday ↗