引线框架结构设计师/Lead Frame Designer
Core
Design semiconductor package lead frames and substrates, defining specifications and layouts to meet chip electrical and thermal requirements.
Role type
Lead Frame Structure Designer
Builds
Semiconductor package lead frames and substrates for chip assembly
Domain
Semiconductor manufacturing / Packaging
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Lead frame structure design, substrate design, layout design, BOM generation, production specification writing, sample prototyping, validation testing, mass production adaptation, process optimization for die bonding/wire bonding/molding, industry standard knowledge, SOP adherence, 8D reporting, yield optimization, cross-functional collaboration, cleanroom compliance
Preferred skills
AutoCAD, Altium Designer, copper frame manufacturing, silver-plated frame manufacturing
Responsibilities
Design lead frame structures and pin layouts based on chip requirements; Output design drawings, BOMs, and production specs; Coordinate with factories for sample prototyping; Follow up on sample validation and mass production compatibility; Optimize structures for full assembly processes (die bonding, wire bonding, molding); Track industry structural iterations
Seniority
Mid-level, hands-on IC
