Principal Product Engineer – High Power Module
Core
Lead product engineering for next-generation automotive-grade power modules using advanced embedded packaging technologies.
Role type
Principal Product Engineer (High Power Module)
Builds
Automotive-grade power modules via prototype builds and qualification runs
Domain
Semiconductor / Automotive Power Electronics
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Power semiconductor technologies, Advanced embedded packaging (chip embedding, interposer integration), Thermal/electrical optimization, Process characterization, Root-cause analysis, SPC, DOE, Data-driven problem solving
Preferred skills
Advanced degree in engineering
Technologies
Chip embedding, Interposer-based integration
Responsibilities
Plan and execute prototype and qualification runs for embedded power modules, Validate build integrity and maintain process documentation, Apply expertise in chip embedding and interposer integration for module development, Conduct root-cause analysis for product issues, Confirm qualification evidence meets internal standards before product release
Seniority
Principal, hands-on IC