Senior Prin, Package Design Engineer
Core
Design cost-effective semiconductor package solutions that satisfy customer functional requirements while meeting design rules, quality, and safety standards.
Role type
Senior IC Package Design Engineer
Builds
New innovative semiconductor package designs
Domain
Semiconductor manufacturing and packaging
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Semiconductor packaging materials knowledge, CAD design (AutoCAD, Solidworks), manufacturing process expertise, 3D modeling, FEA simulation initiation, design rule compliance, DFMEA documentation, supplier coordination
Preferred skills
Cross-functional team coordination, management presentation skills, problem-solving, leadership
Technologies
AutoCAD, Solidworks
Responsibilities
Design and develop innovative package concepts, coordinate with cross-functional teams to meet specifications, create 3D models and initiate FEA simulations, ensure compliance with industry and environmental regulations, document design processes and DFMEA, address design issues and implement changes, support manufacturing site design needs
Seniority
Senior, hands-on IC
