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Packaging Engineer | High Voltage & high power

United States💼 Full-time🗓 2026-05-20 → 2026-07-22

Core

Design, develop, and scale high-voltage (200-3300V) and high-power (5KW–300KW) semiconductor packages and modules for Industrial, Automotive, Renewable, and Telecom markets.

Role type

Senior IC Packaging Engineer (High Voltage & High Power)

Builds

High voltage packages and high-power modules using GaN, SiC, IGBT, and Super Junction MOSFET technologies

Domain

Semiconductor packaging, High Voltage, Power Electronics

Deliverable

production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work

Required skills

High voltage package and power module design, materials, equipment, and assembly flow integration, Silicon/GaN/SiC-package interaction, stress/thermal/electrical modeling analysis, reliability and qualification strategies, supplier landscape knowledge (mold compounds, die attach, substrates), process/equipment integration

Preferred skills

Scaling HV packages from concept to high volume manufacturing, clip attach and flip chip packaging, wafer bumping processes overview, magnetics and high power density enterprise power modules knowledge, HV Bill of Materials expertise, industry/subcon HV packaging capabilities knowledge, conference presentation experience

Technologies

CFD, thermomechanical and electrical parasitic extraction tools, TOLT, TOLG, Q-DPAK, DIP, SIP, case modules

Responsibilities

Define, design, develop, and scale high voltage packages and high-power modules to volume production; build competitive forward-looking package and module roadmaps based on market trends and system requirements; define solutions across various HV technologies and validate using simulation tools; develop new process flows/technologies for 1st article prototype and high volume manufacturing; outline package reliability plans, complete testing, summarize failure modes, and provide solutions; work with various suppliers to provide solutions meeting roadmaps; accelerate development cycles and ensure rapid time-to market for new products

Seniority

Senior, hands-on IC

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