QFN FC Process Development Engineer
Core
Develop sintering processes, materials, and packages for high-power discrete and module applications using SiC technology.
Role type
Process Development Engineer (Power Semiconductor Packaging)
Builds
Power discrete and module packages (e.g., TO220, D-Pak, APM, SPM, IPM, IGBT/Diode modules)
Domain
Semiconductor manufacturing / Power electronics
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Sintering process development, Die bonding process, Semiconductor assembly process development, Equipment and tooling setup, Process troubleshooting and control, Material qualification, Design for Manufacturing (DFM), Failure analysis, Process characterization, MiniTab & Data analysis
Preferred skills
Power discrete package design, Power module package design, APQP implementation, Cross-site technical communication
Technologies
MiniTab
Responsibilities
Conduct package development following APQP specifications; Develop process and package to ensure manufacturability, quality, reliability, and cost goals; Execute process optimization, failure analysis, and process characterization; Mentor junior engineers and technicians in assembly processes; Lead cross-site technical communication and decision-making for new material and process feasibility.
Seniority
Senior, hands-on IC
