Optical 3D Packaging Technologist
Core
Develop and validate optical interconnect packaging solutions (CPO, FAU, OE) for 2.5D/3D/3.5D architectures supporting AI and Datacenter/HPC product families.
Role type
Optical 3D Packaging Technologist
Builds
Optical interconnect package/assembly solutions for 2.5D/3D/3.5D package architectures
Domain
Semiconductor advanced packaging / Optical interconnects
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Optical interconnect development, DFM analysis, Package qualification, NPI management, Yield improvement, Production troubleshooting, Cross-functional collaboration, Technology roadmap delivery
Preferred skills
Experience with CoWoS, SoIC, COUPE, CPO, HBM, FCBGA technologies
Technologies
CoWoS, SoIC, COUPE, CPO, HBM, FCBGA
Responsibilities
Develop and validate optical interconnect including Co-Package-Optics (CPO), Fiber Attachment Unit (FAU), Optical Engine (OE), etc. package/assembly solutions; Conduct DFM analysis and generate design rule sets for 3DIC/CPO packages; Manage technology development, yield improvement, and production issue troubleshooting with suppliers; Develop fundamental optical characterization methodology; In charge of Package Qualification, New Product Introduction (NPI) and HVM.
Seniority
Experienced Technologist