<Data center>Chiplet integrator
Core
Proposing best-fit packaging technology for chiplet integration from an architecture perspective, considering SIPI, testing, and thermal factors.
Role type
Chiplet integrator
Builds
Chiplet packages
Domain
Semiconductor packaging
Required skills
2.5D/3D PKG integration, chip architecture analysis, SIPI knowledge, thermal management, testing protocols
Preferred skills
mass production experience
Technologies
2.5D, 3D, PKG, SIPI
Responsibilities
Propose best-fit PKG technology, evaluate thermal considerations, define testing requirements
Seniority
Mid-level, hands-on IC
