Advanced packaging technology development engineer/ manager
Core
Developing advanced packaging technologies for new product introductions, focusing on chiplet and 3DIC structures.
Role type
Advanced packaging technology development engineer/manager
Builds
Advanced chiplet and 3DIC packaging solutions
Domain
Semiconductor manufacturing / Advanced packaging
Deliverable
production ML models | product features | infrastructure
Required skills
new product introduction (NPI) planning, Design for Reliability (DRC) inspection, Design of Experiments (DOE), yield analysis, wafer-level packaging design, panel-level packaging design
Preferred skills
mass production interval planning, yield improvement strategies
Technologies
3DIC, chiplet packaging
Responsibilities
Plan new product trial production, conduct DRC inspections, execute DOE and yield improvement planning, analyze mass production intervals and yields, design advanced packaging structures at wafer and panel levels
Seniority
Manager, hands-on IC