Packaging Manager/Director
Core
Lead the development of cutting-edge 2.5D/3D packaging solutions for Automotive, Datacenter/HPC, AI, and Computing business units.
Role type
Senior IC packaging development manager/director
Builds
Advanced packaging technologies (CoWoS, EMIB, SoIC, HBM, FCBGA, FCCSP, HBPOP) for high-performance computing and automotive applications
Domain
Semiconductor manufacturing / Advanced packaging
Deliverable
production ML models | product features | infrastructure
Required skills
Advanced packaging technology expertise, supply chain management, cross-functional team leadership, strategic planning, BOM optimization, manufacturability analysis
Preferred skills
Experience with 2.5D/3D integration, knowledge of substrate suppliers and OSATs, customer obsession
Technologies
CoWoS, EMIB, SoIC, HBM, FCBGA, FCCSP, HBPOP
Responsibilities
Lead development of advanced packaging technologies, manage third-party relationships with substrate suppliers and OSATs, monitor and report project progress and manufacturing metrics, serve as primary interface for external customers and partners
Seniority
Senior, hands-on IC with strategic leadership