Director, System in Package Architecture
Core
Lead end-to-end development of advanced packaging system architectures to maximize System in Package (SiP) performance, with a specific focus on High Bandwidth Memory (HBM).
Role type
Director, System in Package Architecture
Builds
Advanced packaging solutions for SOC and HBM integration in 2.5D and 3D environments
Domain
Semiconductor / Advanced Packaging / Memory Technologies
Deliverable
production ML models | product features | infrastructure
Required skills
Advanced packaging architecture definition and strategy, 2.5D/3D packaging technologies, Signal Integrity (SI) analysis, Power Integrity (PI) optimization, High Bandwidth Memory (HBM) integration, Cross-functional team leadership, Technical roadmap planning
Preferred skills
Large body substrate technologies, Mentoring and scaling engineering teams, Master's or PhD in EE/Materials Science, 10+ years in advanced packaging
Technologies
None explicitly listed
Responsibilities
Lead end-to-end development of advanced packaging system architectures, Drive mechanical and electrical test vehicle design, Spearhead R&D of novel technologies for SiP performance, Lead strategic collaborations with internal and external partners
Seniority
Director, strategic leadership with hands-on technical direction
